PLGA from PolySciTech used in development of novel graphene cold-rolled material for microsensor development

 

The ability of PLGA to hydrolyze in the presence of water is commonly utilized in biomedical applications to deliver drugs in a long-acting formulation or for a cell scaffold. However, PLGA’s ability to degrade away can be utilized in manufacturing applications where a temporary structure which can be easily removed after it fulfills its purpose is desired. Researchers at University of Cincinnati and North Carolina A&T State University 3D printed a blend of PLGA (cat# AP234) from PolySciTech Division of Akina, Inc. (www.polyscitech.com) with a nickel catalyst to create a temporary framework for synthesis of complex 3D graphite networks which could be manipulated into sensors for motion or mechanical stress. This research holds promise to provide for enhanced electronics and related components. Read more: Kondapalli, Vamsi Krishna Reddy, Guangqi Zhang, Yu Zhang, Mahnoosh Khosravifar, Kyle Brittingham, Nhat Phan, Sergey Yarmolenko, Je-Hyeong Bahk, and Vesselin Shanov. "Cold Rolling of 3d Graphene: Characterization and Applications." Available at SSRN 4294781. https://papers.ssrn.com/sol3/papers.cfm?abstract_id=4294781

“Abstract: Previously, we reported 3D Shaped 3D Graphene (3D2G) with controlled structural pores. In this work, we introduce cold rolling as a post-processing technique to obtain compressed 3D2G referred to as C3D2G. The gravimetric density, electrical conductivity, and tensile strength of C3D2G were higher than 3D2G by 37.3, 53.4, and 24.9 times, respectively. The performed comprehensive materials characterization of C3D2G revealed the micro-motion of the graphene flakes from their random orientations into a stacked and aligned structure along with the extrusion of bulk material into the structural pores which acted as stress-relief spaces. Further, a new process was demonstrated enabling the welding of multiple pieces into one structure via cold rolling, thus showing potential for dimensional scaling up. The conducted tensile and electrical conductivity studies across the welded region revealed the presence of a mechanical bond within the joined area with a higher strength than the initial pieces involved in welding. Due to the enhanced properties of C3D2G, a unique application of this material was explored as a reusable, etch-resistant hard mask for patterning silicon wafers, and as a protective barrier against fluorine plasma environment. The etch rate measurements showed a higher etching resistance of C3D2G compared to Si and SiO2 when exposed to a fluorine plasma Reactive Ion Etching (RIE). Keywords: 3D graphene, CVD, additive manufacturing, cold rolling, dry etch, welding, hard masks, Reactive Ion Etching (RIE)”